HORIBA LEM Camera Endpoint Monitor based on Real Time Laser Interferometry-Tamasak (M) Sdn Bhd 京都玉崎马来亚西亚公司

HORIBA LEM Camera Endpoint Monitor based on Real Time Laser Interferometry

HORIBALEMCamera Endpoint Monitor based on Real Time Laser InterferometrySpecifications:System outlineLEM camera consists of a compact interference measurement section that includes the laser source, l

model：

HORIBA

LEM

Camera Endpoint Monitor based on Real Time Laser Interferometry

Specifications:

System outline

LEM camera consists of a compact interference measurement section that includes the laser source, light receiver, and optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images.

Light source

Laser diode

Light source wavelengths

670 nm, 905 nm, 980 nm

Magnification

50x (G50) or 120x (G120)

Spot diameter

20 μm to 100 μm,
depending on camera to wafer distance

Detector

Pin-photo diode

Camera Dimensions

65 (W) × 160 (H) × 100 (D) mm
2.6 (W) × 6.3 (H) × 3.9 (D) in
(camera only, excluding stage)

Camera mass

1.2 kg, 2.6 lb

Remote

LEM-CT only may be connected to any host through digital Link with RJ 45 connector: TCP/IP.
An optional SEQ70 box contains an interface board to provide galvanic isolation between the host controller hardware of the HOST / Tool from the box main electronics

Label on	Description	Plug type
Remote	PIO, RS, analog 0-5V	Female DB25

scrollable

This permits to communicate by logic wiring, fast, deterministic with full optocouplers and power spikes isolation, frequently found in industrial fab environment