USHIO
UX-5
Step-by-step projection exposure device for high-density IC carrier board UX-5
Specifications:
U Maintain overlapping accuracy even if the substrate shrinks
Perform high-precision correction for each exposure area. In addition, the "automatic measurement function" of automatic zoom of up to 0.1% according to the type of telescopic is used to correct the projection magnification, which greatly reduces the correction deviation caused by the shrinkage of the substrate.
U unique TTL non-exposure wavelength 4 photo team positioning method
Using USHIO patented technology "TTL non-exposure wavelength correction", when observing the mask mark, the exposure will not reach the substrate correction mark. In addition, the working marks can be directly observed, and the brightness will not be reduced due to the mask, so the high-precision correction can be carried out by the distinctive marks.
U is suitable for various calibration targets
It has a "type comparison function" suitable for storage types, and can perform various wiring types of correction without special calibration marks.
U High resolution ability
Equipped with USHIO's projection lens "UPL series" to achieve high resolution ability. It is suitable for the formal mass production of the design specifications of 5mμ line/space.
U Deeper Focus Depth
Even if the depth of the focus is deep (±50~100μm) causes the difference in the height of the substrate or the image shift caused by bending or relaxation, the same type of section as the correct focus can be obtained. Especially the thick film of dry adhesive film is more effective when the inhibitor is exposed.
U High-speed step and repetition through the surface table
Precision air bearings are used to eliminate friction, and the lightweight and high rigidity of the activity department is achieved through the surface motor construction, so as to achieve high-speed stepping and repetitive actions. In addition, the surface table implements the feedback control of the laser interferometer, and at the same time achieves high-speed action and high position determination accuracy.