SAKAGUCHIAtomic-level anti-aliased heat treatment minimal device (minimal laser hydrogen annealing device)Specifications:· φ12.5mm wafer (sheet-leaf treatment)· Compact housing (about 30 c
SAKAGUCHI
Atomic-level anti-aliased heat treatment minimal device (minimal laser hydrogen annealing device)
Specifications:
· φ12.5mm wafer (sheet-leaf treatment)
· Compact housing (about 30 cm wide)
· No need for a clean room
· Low power consumption (rated AC100V 10A)
· Ultra-high vacuum compatible (5 × 10 -5 Pa or less)
· Rapid temperature rise and fall (2.5 seconds to 1100℃)
· Stable temperature control (1100℃±0.5℃)
· Uniform temperature distribution (variability (σ/Ave.) 0.5%)