CEMEDINE

CEMEDINE Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811 One Component Epoxy Adhesives

Brand: CEMEDINEModel: Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811Product Name: One Component Epoxy AdhesivesSpecifications:Multi-purpose typeEP138

  • model:

Brand: CEMEDINE

Model: Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811

Product Name:  One Component Epoxy Adhesives


Specifications:

Multi-purpose type


EP138EP106NLEP116新EP171
Application / Properties / FeaturesHigh-viscosity non-sag typeLow-viscosity flow typeLow-viscosity flow type/High peel-resistant typeLow-temperature curing type
TypeOne-Part Heat Curing Epoxy Adhesive
BaseEpoxy resinEpoxy resinEpoxy resinEpoxy resin
AppearanceLight yellowish brownMilky whiteGrayLight brown
ViscosityPa・s/23℃2402210.750
Densityg/cm31.41.181.21.19
Standard curing conditions120℃×30min120℃×40min150℃×20min80℃×30min
150℃×20min140℃×30min
120℃×10min
Tensile Shear StrengthMPa25.624.130.422.1
T-Peel StrengthN/mm3.063.484.60.2
Cured propertiesHardnessShore D88848087
Glass transition temperature122919683
Elastic modulusMPa


1215
Curing Shrinkage Rate%


0.53
Water Absorption Ratio%0.10.14
0.13
Linear Expansion Coefficient5.7×10-57.8×10-57.6×10-56.0×10-5
Electric CharacteristicsVolume ResistivityΩ・cm3.0×10152.6×1015
3.0×1015
Surface ResistivityΩ/sq


6.6×1015
Insulation Breakdown VoltagekV/mm16<


Dielectric Constant100Hz4.7

3.6/1kHz
Dielectric Loss Tangent100Hz0.01

0.01/1kHz
Storage temperature0~100~100~100~10
Capacity1kg1kg1kg1kg
3kg3kg20kg20kg

Flexible type


EP170EP170-2
Application / Properties / FeaturesHigh peel-resistant typeHigh peel-resistant type
/Non-sag type
TypeOne-Part Heat Curing Epoxy Adhesive
(Flexible type)
BaseEpoxy resinEpoxy resin
AppearanceLight yellowLight yellow
ViscosityPa・s/23℃170340
Densityg/cm31.131.12
Standard curing conditions110℃×60min110℃×60min
120℃×30min120℃×30min
Tensile Shear StrengthMPa15.110.8
T-Peel StrengthN/mm6.676.6
Cured propertiesHardnessShore D55
Glass transition temperature20
Water Absorption Ratio%0.23
Linear Expansion Coefficient30×10-5
Electric CharacteristicsVolume ResistivityΩ・cm3.0×1015
Capacity1kg1kg



Heat resistance type


EP160
Application / Properties / FeaturesHeat-resistant type
/Medium viscosity
TypeOne-Part Heat Curing Epoxy Adhesive
BaseEpoxy resin
AppearanceLight brown
ViscosityPa・s/23℃100
Densityg/cm31.16
Standard curing conditions110℃×60min
120℃×30min
Tensile Shear StrengthMPa16.8
T-Peel StrengthN/mm1.18
Cured propertiesHardnessShore D85
Glass transition temperature140
Elastic modulusMPa414
Breaking StrengthN/mm222.6
Elongation At Break%
Curing Shrinkage Rate%2.43
Water Absorption Ratio%0.05
Linear Expansion Coefficient6.5×10-5
Electric CharacteristicsVolume ResistivityΩ・cm2.6×1015
Surface ResistivityΩ/sq
Insulation Breakdown VoltagekV/mm
Dielectric Constant100Hz4.5
Dielectric Loss Tangent100Hz0.011 (1kHz)
Capacity1kg

Potting electronics


EP811
Application / Properties / FeaturesFlow type
TypeOne-Part Heat Curing Epoxy Adhesive
BaseEpoxy resin
AppearanceBlack
ViscosityPa・s/23℃82
Densityg/cm31.71
Standard curing conditions120℃×30min
Tensile Shear StrengthMPa19.7
Cured propertiesHardnessShore D91
Glass transition temperature134
Elastic modulusMPa6600
Poisson's ratio
0.3
Breaking StrengthMPa59
Elongation At Break%1.19
Water Absorption Ratio%0.05
Linear Expansion Coefficient25
Electric CharacteristicsVolume ResistivityΩ・cm5.0×1015
Insulation Breakdown VoltagekV/mm22<
Dielectric Constant100Hz5.2
Dielectric Loss Tangent100Hz0.1
Capacity4kg
10kg


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