OMRON VT-S1080-V2.0 VT-S1040-V2.0 VT-Z600-V2.0 PCB Inspection System

Brand: OMRONModel: VT-S1080-V2.0 VT-S1040-V2.0 VT-Z600-V2.0Product Name: PCB Inspection System Specifications:TypeVT-S1080-V2.0VT-S1040-V2.0VT-Z600-V2.0Outer dimentions1180(W) x 1450(

  • model:

Brand: OMRON

Model: VT-S1080-V2.0        VT-S1040-V2.0          VT-Z600-V2.0

Product Name: PCB Inspection System


Specifications:

Type

VT-S1080-V2.0

VT-S1040-V2.0

VT-Z600-V2.0

Outer dimentions

1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor)

Weight

Approx. 1240Kg

Power supply

200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz

Rated power

2.0 kVA (Maximum current 10 A)

Line height

900±20mm

Air supply

Not required

Operating temperature
range

1035℃

Operating humidity
range

35 to 80% RH (Non-condensing)

Camera

Direct

25Mpix

Oblique

5Mpix

-

-

Resolution

Direct

12.5μm

Oblique

10μm

-

-

FOV

Direct

52.5 x 52.5mm

Oblique

25.9 x 19.4mm

-

-

Inspection principle

Hybrid 3DShape
reconstruction
MDMC*12
illumination+Phase shift
(MPS *13)

Hybrid 3DShape
reconstruction
MDMC*12
illumination+Phase shift
(MPS *13*14)

2.5D Shape reconstruction
MDMC*12 illumination

Supported
PCB size

Size

Single lane: 50(W) x 50(D)510(W) x 680(D)mm
Dual lane: 50(W) x 50(D)
510(W) x 330(D)mm

Thickness

0.44mm

Weight

4Kg

Clearance

Clearance on PCB: 50mm from board surface
Clearance under PCB: 50mm from the back of the board
(including PCB warpage, deflection, component tolerance, etc.)

Height measurement
range

25.4mm

-

Inspection item

Component height, lift, tilt, missing or wrong component,
wrong polarity, flipped component, OCR inspection,
2D code, component offset (X/Y/rotation),
fillet*15 (height/length, end joint width, wetting angle,
side joint length), exposed land, foreign material,
land error, lead offset, lead posture, lead presence,
solder ball, solder bridge, distance between components,
component angle

Missing or wrong component,
wrong polarity, flipped component,
OCR inspection, 2Dcode,
component offset (X/Y/rotation),
fillet (height/length, end joint width,
wetting angle, side joint length)*15,
exposed land, foreign material,
land error, lead offset, lead posture,
lead presence, solder ball,
solder bridge, distance between
components, component angle


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