KYOWAEP-17 Cured by heatingAdhesives and Bonding ToolsSpecifications:TypesCured by heatingOperating Temperature (℃)-50 to 170Major Applicable MaterialsMetal (Steel, stainless steel, copper, aluminum a
KYOWA
EP-17 Cured by heating
Adhesives and Bonding Tools
Specifications:
Types | Cured by heating |
Operating Temperature (℃) | -50 to 170 |
Major Applicable Materials | Metal (Steel, stainless steel, copper, aluminum alloys, etc.) |
Curing Requirements | After finger pressure, apply tape pressure while heating it for cure for 2 hours at 130℃, 2 hours at 150℃ |
Category | Epoxy liquid and power mixed |
Capacity | 30 g |
Features | Dedicated for semiconductor gages (KSN-2-120-E5) . |
Major Applicable Gages | KSNB-2-E5 |