SAKAGUCHIAtomic level anti-aliase heat treatment minimal device (minimal laser hydrogen annealing device)Specifications:· φ12.5mm wafer (sheet processing)· Compact housing (about 30cm wide
SAKAGUCHI
Atomic level anti-aliase heat treatment minimal device (minimal laser hydrogen annealing device)
Specifications:
· φ12.5mm wafer (sheet processing)
· Compact housing (about 30cm wide)
· No clean room required
· Low power consumption (rated AC100V 10A)
· Ultra-high vacuum compatible (5 x 10 -5 Pa or less)
· Rapid temperature rise and drop (2.5 seconds to 1100℃)
· Stable temperature control (1100℃±0.5℃)
· Uniform temperature distribution (variance (σ/Ave.) 0.5%)